Standard PCB service refers to full feature printed circuit board manufacturing service. With 30 years' experience in PCB fabrication, we have handled hundreds of thousands of PCB projects, and covered almost all kinds of substrate materials including FR4, Aluminum, Rogers, etc. This page only touches standard FR4 based PCB. For PCBs with special technical substrate, please refer qoutation.
It is recommended to use Standard PCB service when your design is ready to transform from prototype phase to production phase. We can manufacture up to 1000 pcs pieces high quality PCBs with very competitive prices. To endow your project with expected function and more possibilities, we offer advanced features for Standard PCB services.
Comprehensive capabilities can be found in the following table:
| Feature | Capability |
|---|---|
| Quality Grade | Standard IPC 2 |
| Number of Layers | 1 – 8layers |
| Order Quantity | 1pc - 10,000pcs |
| Build Time | 2days - 5weeks (Expedited Service) |
| Material | FR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg 180°C, FR4-Halogen-free, FR4-Halogen-free & High-Tg |
| Board Size | Min 9*9mm | Max 450*600mm |
| Board size tolerance | ±0.1mm - ±0.3mm |
| Board Thickness | 0.4mm - 3.2mm |
| Board Thickness Tolerance | ±0.1mm - ±10% |
| Copper Weight | 0.5oz - 6.0oz |
| Inner Layer Copper Weight | 0.5oz - 2.0oz |
| Copper Thickness Tolerance | +0μm +20μm |
| Min Tracing/Spacing | 6mil/6mil |
| Solder Mask Sides | As per the file |
| Solder Mask Color | Green, White, Blue, Black, Red, |
| Silkscreen Sides | As per the file |
| Silkscreen Color | White, Black |
| Surface Finish | HASL - Hot Air Solder Leveling |
| Lead Free | HASL - RoHS |
| ENIG - Electroless Nickle/Immersion | Gold - RoHS |
| Immersion | Silver - RoHS |
| Immersion | Tin - RoHS |
| OSP -Organic | Solderability Preservatives - RoHS |
| Min Annular Ring | 6mil |
| Min Drilling Hole Diameter | 8mil |
| Min Width of Cutout (NPTH) | 0.8mm |
| NPTH Hole Size Tolerance | ±.005" (±0.05mm) |
| Min Width of Slot Hole (PTH) | 0.6mm |
| PTH Hole Size Tolerance | ±.005" (±0.08mm) - ±.006" (±0.15mm) |
| Surface/Hole Plating Thickness | 20μm - 30μm |
| SM Tolerance (LPI) | .003" (0.075mm) |
| Aspect Ratio | 1.10 (hole size: board thickness) |
| Test | 10V - 250V, flying probe or testing fixture |
| Impedance tolerance | ±5% - ±10% |
| SMD Pitch | 0.2mm(8mil) |
| BGA Pitch | 0.2mm(8mil) |
| Other Techniques | |
| Gold fingers | |
| peelable solder mask | |
| Edge plating | |
| Kapton tape | |
| Half-cut/Castellated hole | |
| Press fit hole | |
| Via tented/covered with resin | |
| Via plugged/filled with resin | |
| Via in pad | |
| Electrical Test |